Panasonic VT-901 material it is wide used in this sophisticated equipment, the chip testing furnace.

The stability and reliability of the PCB board directly affect the accuracy of the chip test data. The 6-layer PCB board (with dimensions of 608*320mm), made of Panasonic VT-901 material, is providing crucial support for NXP chip testing furnace.

The characteristics of the Panasonic VT-901 material

The Panasonic VT-901 material is famous for its low dielectric constant (Dk) and low dielectric loss (Df). It can effectively reduce signal attenuation in high-frequency signal transmission, which is crucial for the stable transmission of multi-channel test signals within the chip testing furnace.

During the chip testing process, it is necessary to conduct high-frequency detection on multiple sets of chip parameters simultaneously. The characteristics of the VT-901 material can ensure that the interference between different test signals in minimi, thereby guaranteeing the accuracy of data collection.

The advantages of the 6-layer board design

The design of the 6-layer board meets the integration requirements for the complex circuits of the test furnace.

The size of 608*320mm provides sufficient layout space for multiple test interfaces, control modules and power lines. Through a reasonable layering design, the signal layer, grounding layer and power layer are orderly to separate, further reducing electromagnetic interference.

Meanwhile, the high-temperature resistance and excellent mechanical strength of the VT-901 material enable it to adapt to the long-term high-temperature working conditions inside the testing furnace, preventing the deformation of the plates or fluctuations in performance caused by temperature changes.

The cooperation with NXP

As an important supporting component of NXP in the field of chip testing, this PCB board, with the stability of Panasonic materials and the functionality of multi-layer design, provides a solid hardware foundation for the efficient operation of the chip testing furnace, helping NXP achieve precise and reliable quality inspection of chips.