Metal substrates are key materials used for heat dissipation in the electronics industry, mainly divid into three categories: aluminum substrates, copper substrates, and ceramic substrates, each with different characteristics and applicable scenarios.

Metal substrates-aluminum substrate

Aluminum substrates are compose of copper foil, insulation layer, and aluminum alloy, which have high heat dissipation and lightweight advantages, and are widely use in fields such as LED lighting and power equipment.

Its thermal conductivity can reach 25-35W/(m · K), effectively reducing thermal resistance and ensuring stable operation of electronic components.

However, aluminum substrates are not suitable for high-frequency circuits or environments with severe temperature fluctuations, and may cause component failure due to thermal expansion and contraction. ‌

Metal substrates-copper substrate

The copper substrate uses copper alloy as the base layer, with the best thermal conductivity (thermal conductivity of about 170-230W/(m · K)), suitable for scenarios with extremely high heat dissipation requirements such as high-frequency circuits and precision communication equipment.

But the cost is high and requires antioxidant treatment, otherwise it is prone to oxidation and corrosion. ‌

ceramic substrate

Ceramic substrates (such as alumina, aluminum nitride, etc.) are mainly proudce of inorganic materials, with a thermal conductivity of 80-100W/(m · K), high temperature resistance, and strong stability, suitable for high-power, high-frequency, and high-temperature environments (such as new energy vehicles and industrial control equipment).

But it is brittle and difficult to machine. ‌
When selecting, it is necessary to consider the application scenario: ceramic for high frequency/high temperature, aluminum substrate for ordinary heat dissipation needs, and copper substrate for extreme heat dissipation needs (such as CPU)

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