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Chip Controllers PCBA Assembly: China-Germany Manufacturing Collaboration​

September 4, 2025

Chip Controllers PCBA Assembly: China-Germany Manufacturing Collaboration​

Chip Controllers PCBA Assembly to realize their functions, and China-Germany cooperation strengthens this core connection.​

Germany’s Semiconductor Industry: Focusing on Power Semiconductors and PCBA Optimization​

Currently, Germany’s semiconductor industry mainly focuses on the fields of power semiconductors and green energy chips. Infineon Dresden gets €920M EU subsidy for 8-inch SiC wafers. And its EG120 chip optimizes PCBA layout, cuts parts, boosts reliability. Meanwhile, TSMC sets Munich design center, partners ESMC for auto chips, which lays foundation for subsequent Chip Controllers Assembly.​

China-Germany Cooperation: Focusing on Mutual Support for Chip Controllers PCBA Assembly

In China-Germany industrial cooperation, the two sides cooperate particularly closely in the PCBA assembly link of chip controllers. Firstly, Infineon first signed a long-term SiC supply agreement with China’s TankeBlue to ensure the stable PCBA production capacity for the electric drive modules of new energy vehicles. Moreover, the Wuxi R&D team also joined hands with German engineers to optimize the PCBA integration solution. By sharing technical documents and conducting joint tests, the team finally reduced the system power consumption by 30%. Ultimately, this model of “German chip precision + Chinese assembly efficiency” has shown very good results in the fields of automotive-grade MCUs and industrial control.

Policy and Industry: Promoting the Full-Chain Innovation of Chip Controllers​

From the perspective of policy-industry linkage, Germany’s Chips Act has added a €2 billion subsidy, focusing on tilting resources towards the microchip assembly link. China’s large-scale production capacity in the PCBA industry can just help German chips expand the global market.Driven by both policy guidance and industrial demand, thus the two sides have gradually formed a cooperative closed loop—starting from chip design, progressing to wafer manufacturing, and finally culminating in PCBA assembly. One focused on integrating chip controllers into PCBA processes. Thus this loop jointly promotes Chip Controllers’ full-process innovation.​ Spanning high-performance chip controller R&D to PCBA module mass production.​

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