Integrated Circuit Manufacturing is the core segment of the exhibition, showcasing industrial vitality in a whole-chain format and serving as a key platform for displaying global semiconductor innovation achievements, with its whole-chain cooperation building a robust industrial innovation ecosystem.

Kicking off from Shenzhen and facing the world, the 27th China Hi-Tech Fair (CHTF) Asia Artificial Intelligence and Robotics Industry Chain Exhibition will be grandly held at Shenzhen World Exhibition & Convention Center (Bao’an) from November 14 to 16, 2025—where this core segment further acts as a bridge for global semiconductor innovation, leveraging its whole-chain advantages to link technology R&D and industrial application.

Integrated Circuit Manufacturing: Whole-Chain Cooperation for Innovation Ecosystem

Centered on the core needs of integrated circuit manufacturing, the exhibition has set up seven professional exhibition areas, covering key links such as IC design, integrated circuit manufacturing, advanced packaging and testing, semiconductor equipment, electronic components, semiconductor materials, and power devices. Among them, the Advanced Packaging and Testing Zone will display cutting-edge technologies like Chiplet; the Semiconductor Equipment Section will gather core equipment such as lithography and etching tools; and the Semiconductor Materials Zone will exhibit critical materials including large-size silicon wafers and photoresist, forming an industrial closed-loop ecosystem “from technology R&D to production application.”

Meanwhile, the featured High-Tech Products Zone also stands out as a highlight. Exhibitors showcase intelligent robots, bionic robot dogs, industrial-grade UAVs, smart speakers and other products together here, demonstrating how integrated circuit technology drives terminal innovation achievements. The AI Precision Medical Consultation Zone combines intelligent diagnostic algorithms with medical data to showcase breakthrough applications of artificial intelligence in precision medicine. Forming a multi-faceted display model of “core technologies + end products + scenario implementation.”

AI Propels Terminal Innovation: Scenario-Led Multi-Field Expansion

This exhibition not only builds an efficient cooperation and docking platform for upstream and downstream enterprises in the industrial chain but also promotes the upgrading of global integrated circuit manufacturing technology through the display of technological achievements and industrial exchanges. As a highland for semiconductor industry innovation in China. Shenzhen will leverage the global influence of CHTF to attract top domestic and foreign enterprises and scientific research institutions to participate. Helping China’s integrated circuit industry break through key technological bottlenecks and accelerate the realization of independent and controllable industrial chain as well as high-quality development.